? semiconductor components industries, llc, 2015 august, 2015 ? rev. 0 1 publication order number: MBRS3201P/d MBRS3201P 200v, 3a schottky fast soft-recovery power rectifier smc power surface mount package features ? lower forward voltage than any ultrafast rectifier: v f < 0.59 v at 150 c ? fast switching speed: reverse recovery time (t rr ) < 35 ns ? soft recovery characteristics: softness factor (t b /t a ) 1 ? highly stable over temperature ? these are pb?free packages benefits ? significantly reduced emi ? eliminates the need of snubber circuits ? low switching and heat losses ? improved thermal management applications ? engine and convenience control systems ? motor controls ? battery chargers and switching power supplies mechanical characteristics ? small compact surface mount package with j-bend leads ? rectangular package for automated handling ? weight: 217 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? esd ratings: ? machine model = a ? human body model = 1c ? lead and mounting surface temperature for soldering purposes: 260 c maximum for 10 seconds ? cathode polarity band www. onsemi.com device package shipping ? ordering information schottky rectifier 3 amps, 200 volts ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. MBRS3201Pt3g smc (pb?free) 2500 / tape & reel b321 = specific device code a = assembly location y = year ww = work week = pb?free package marking diagram (note: microdot may be in either location) smc case 403ac ayww b3x
MBRS3201P www. onsemi.com 2 maximum ratings characteristic symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current (rated v r , t c = 70 c) i f(av) 3 a nonrepetitive peak surge current i fsm 100 a operating junction temperature t j ?55 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. thermal characteristics characteristic symbol value unit thermal resistance, junction?to?lead r jl 12 c/w thermal resistance, junction?to?ambient r ja 60 c/w electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (i f = 3 a, t j = 25 c) (i f = 3 a, t j = 150 c) v f 0.84 0.59 v maximum instantaneous reverse current (rated v r ) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 150 c) i r 1.0 5.0 ma ma maximum reverse recovery time (i f = 1 a, di/dt = 100 a/us, v r = 30 v) t rr 35 ns 0.1 1.0 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 v f , instantaneous voltage (v) i f , forward current (a) 25 c 150 c 100 c figure 1. typical forward voltage 0.1 1.0 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 v f , instantaneous voltage (v) i f , forward current (a) 25 c 150 c 100 c figure 2. maximum forward voltage
MBRS3201P www. onsemi.com 3 v r , reverse voltage (v) i r , reverse current (a) figure 3. typical reverse current 1e?9 1e?8 1e?7 1e?6 1e?5 1e?4 1e?3 1e?2 1e?1 0 20 40 60 80 100 120 140 160 180 200 150 c 100 c 25 c figure 4. maximum reverse current 1.0e?06 160 0 20 40 60 80 100 v r , reverse voltage (v) 120 140 180 20 0 i r , maximum reverse current (a ) t c = 25 c t c = 150 c 1.0e?05 1.0e?04 1.0e?03 1.0e?02 1.0e?01 c, capacitance (pf) 1.0 10 100 1000 0 20 40 60 80 100 120 140 160 180 200 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 dc square v r , reverse voltage (v) p fo , average power dissipation (w) figure 5. typical capacitance i o , average forward current figure 6. power dissipation 0 1 2 3 4 5 6 7 80 90 100 110 120 130 140 150 160 i f , average forward current (a) t l , lead temperature ( c) figure 7. derating curve dc squarewave
MBRS3201P www. onsemi.com 4 package dimensions smc 2?lead case 403ac issue o dim a min max millimeters 1.95 2.65 a1 0.05 0.20 b 2.90 3.20 c 0.15 0.41 d 5.55 6.25 e 7.75 8.15 l 0.75 1.60 6.60 7.15 e1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended e1 b d c l a1 a notes: 1. dimensioning and tolerancing per anme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimensions d and e1 do not include mold flash. mold flash shall not exceed 0.13 per side. 4. dimensions d and e1 to be determined at datum h. 5. dimension b shall be measured within the area de- termined by dimension l. top view side view end view dimensions: millimeters 2.25 8.75 2x e detail a detail a 3.79 2x soldering footprint* on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 MBRS3201P/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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